Semiconductor back-end processes | The role, process, and evolution of semiconductor packaging

01

Semiconductor Packaging Process Four Levels

The hardware structure of electronic packaging technology and devices is related to the packaging of active components 1 (such as semiconductors) and passive components 2 (such as resistors and capacitors 3). Therefore, the scope covered by electronic packaging technology can be divided into four different levels, ranging from Level 0 packaging to Level 3 packaging. Figure 1 illustrates the entire process of semiconductor packaging. First is Level 0 packaging, responsible for cutting the wafer; next is Level 1 packaging, essentially chip-level packaging; then comes Level 2 packaging, responsible for mounting the chip onto a module or circuit card; finally, Level 3 packaging involves installing the circuit card with attached chips and modules onto the system board. Broadly speaking, the entire process is usually referred to as "packaging" or "assembly." However, in the semiconductor industry, semiconductor packaging typically only involves wafer cutting and chip-level packaging processes.

1、Active Components: Devices that require an external power source to achieve their specific functions, such as semiconductor memory or logic semiconductors.

2、Passive Components: Devices that do not have active functions such as amplification or energy conversion.

3、Capacitor: A component that stores charge and provides capacitance.

▲Image 1: Semiconductor Packaging Levels (Source: "Principle of Electronic Packaging," Page 5)

Packaging typically takes the form of Fine-pitch Ball Grid Array (FBGA) or Thin Small Outline Package (TSOP), as illustrated in Figure 2. The tin balls 4 in FBGA packaging and the leads 5 in TSOP packaging respectively serve as pins, enabling electrical and mechanical connections between the packaged chip and external components.

3、Solder: A low-melting-point metal used for electrical and mechanical bonding.

4、Lead: A wire extending from the terminal of a circuit or component to connect to a circuit board.

▲Image 2: Semiconductor Packaging Examples (Source: ⓒ HANOL Publishers)

02

The Function of Semiconductor Packaging

Figure 3 illustrates the four main functions of semiconductor packaging, including mechanical protection, electrical connection, mechanical connection, and heat dissipation. Among these, the primary function of semiconductor packaging is to protect chips and devices from physical and chemical damage by sealing them in packaging materials such as epoxy resin molding compound (EMC). Despite semiconductor chips being manufactured through hundreds of wafer processes to achieve various functions, the main material is silicon. Silicon, like glass, is very fragile. The structures formed through numerous wafer processes are also susceptible to physical and chemical damage. Therefore, packaging materials play a crucial role in protecting the chips.

▲Image 3: Functions of Semiconductor Packaging (Source: ⓒ HANOL Publishers)

Additionally, semiconductor packaging facilitates electrical and mechanical connections between the chip and the system. Through electrical connections between the chip and the system, packaging provides power to the chip and establishes input and output pathways for signals. Regarding mechanical connections, it is essential to securely link the chip to the system to ensure a reliable connection during usage.

Simultaneously, packaging must efficiently dissipate the heat generated by semiconductor chips and devices. During the operation of semiconductor products, heat is produced as current passes through resistances. As shown in Figure 3, semiconductor packaging completely encases the chip. If semiconductor packaging fails to dissipate heat effectively, the chip may overheat, causing the internal transistors to warm up too quickly and rendering them inoperable. Therefore, effective heat dissipation is crucial for semiconductor packaging technology. With semiconductor product speeds increasing and functionalities expanding, the cooling function of packaging becomes increasingly important.

01

Semiconductor Packaging Process Four Levels

The hardware structure of electronic packaging technology and devices is related to the packaging of active components 1 (such as semiconductors) and passive components 2 (such as resistors and capacitors 3). Therefore, the scope covered by electronic packaging technology can be divided into four different levels, ranging from Level 0 packaging to Level 3 packaging. Figure 1 illustrates the entire process of semiconductor packaging. First is Level 0 packaging, responsible for cutting the wafer; next is Level 1 packaging, essentially chip-level packaging; then comes Level 2 packaging, responsible for mounting the chip onto a module or circuit card; finally, Level 3 packaging involves installing the circuit card with attached chips and modules onto the system board. Broadly speaking, the entire process is usually referred to as "packaging" or "assembly." However, in the semiconductor industry, semiconductor packaging typically only involves wafer cutting and chip-level packaging processes.

1、Active Components: Devices that require an external power source to achieve their specific functions, such as semiconductor memory or logic semiconductors.

2、Passive Components: Devices that do not have active functions such as amplification or energy conversion.

3、Capacitor: A component that stores charge and provides capacitance.

▲Image 1: Semiconductor Packaging Levels (Source: "Principle of Electronic Packaging," Page 5)

Packaging typically takes the form of Fine-pitch Ball Grid Array (FBGA) or Thin Small Outline Package (TSOP), as illustrated in Figure 2. The tin balls 4 in FBGA packaging and the leads 5 in TSOP packaging respectively serve as pins, enabling electrical and mechanical connections between the packaged chip and external components.

3、Solder: A low-melting-point metal used for electrical and mechanical bonding.

4、Lead: A wire extending from the terminal of a circuit or component to connect to a circuit board.

▲Image 2: Semiconductor Packaging Examples (Source: ⓒ HANOL Publishers)

02

The Function of Semiconductor Packaging

Figure 3 illustrates the four main functions of semiconductor packaging, including mechanical protection, electrical connection, mechanical connection, and heat dissipation. Among these, the primary function of semiconductor packaging is to protect chips and devices from physical and chemical damage by sealing them in packaging materials such as epoxy resin molding compound (EMC). Despite semiconductor chips being manufactured through hundreds of wafer processes to achieve various functions, the main material is silicon. Silicon, like glass, is very fragile. The structures formed through numerous wafer processes are also susceptible to physical and chemical damage. Therefore, packaging materials play a crucial role in protecting the chips.

▲Image 3: Functions of Semiconductor Packaging (Source: ⓒ HANOL Publishers)

Additionally, semiconductor packaging facilitates electrical and mechanical connections between the chip and the system. Through electrical connections between the chip and the system, packaging provides power to the chip and establishes input and output pathways for signals. Regarding mechanical connections, it is essential to securely link the chip to the system to ensure a reliable connection during usage.

Simultaneously, packaging must efficiently dissipate the heat generated by semiconductor chips and devices. During the operation of semiconductor products, heat is produced as current passes through resistances. As shown in Figure 3, semiconductor packaging completely encases the chip. If semiconductor packaging fails to dissipate heat effectively, the chip may overheat, causing the internal transistors to warm up too quickly and rendering them inoperable. Therefore, effective heat dissipation is crucial for semiconductor packaging technology. With semiconductor product speeds increasing and functionalities expanding, the cooling function of packaging becomes increasingly important.