What Are The Advantages of Vertical Stacking of Chips?

What is wire bonding?

As shown in the figure above, Wire bonding is an electrical connection between the pad on the chip and the pins on the package substrate with thin gold wires. The general process is the first point welding == "pull wire ==" The second point welding == "welding wire cutting and other steps.

What is vertical stacking?
wire bonding is a plane encapsulation method. Vertical stacking is generally carried out by TSV transfer board, TGV transfer board, stacking in the Z axis direction.

The disadvantages of wire bonding?

As is shown in the picture above,
1. Because Wire Bonding is connected with horizontal leads, the signal needs to be transmitted through a longer wire, which will increase the transmission path of the signal, resulting in increased signal delay.
2, the signal transmission distance is long, resulting in increased power consumption, especially in high-performance applications.
3, the occupied area is too large, not suitable for highly integrated packaging.
4, low reliability, under the influence of thermal cycle, vibration and other external factors, the gold line loosens or falls off.

The vertical stack based on TSV and TGV solves the above problems well.