What Does An IGBT Module Consist Of?

The IGBT power module is mainly composed of IGBT chip, copper coated ceramic substrate (referred to as "DBC substrate", including upper copper layer, ceramic layer and lower copper layer), bonding wire, solder layer, heat dissipation substrate and so on.

The manufacturing process of the IGBT power module is to patch two or more IGBT chips to the copper-covered ceramic substrate according to the specific circuit design, and link them with metal wire bonding. At the same time, the copper-covered ceramic substrate and the cooling substrate are welded, and then the whole potting is performed. The main components and functions of IGBT power module are as follows:

IGBT chip: the core of the whole IGBT power module, which plays the role of frequency conversion, inverter, transformer, power amplification, power control and so on.

Copper coated ceramic substrate (DBC substrate) : the main components are aluminum oxide, aluminum nitride or silicon nitride, etc., which plays the role of insulation, thermal conductivity, mechanical support, etc., and various graphics can be etched on the copper coated layer to draw circuit lines.

Bonding line: to achieve internal electrical interconnection, including the electrical connection between the chip and the chip, the electrical connection between the chip and the solder joint, and the electrical connection between the solder joint and the solder joint.

Heat dissipation substrate: the core heat dissipation function structure and channel of the power module, mainly plays the role of heat conduction, and plays the role of mechanical support and structural protection.