Product Classification
- Heater
- PCB Board Vaccum Cleaner
- Heat Exchanger
- DI Water Heater System
- Wafer Cassette
- More Categories
- Less Categories
Views: 0 Author: Site Editor Publish Time: 2024-04-24 Origin: Site
What indicators should be tested before monocrystalline silicon flakes are shipped?
Monocrystalline silicon wafer to test some items before shipment, what specific indicators will be tested?
Let's take a 4-inch monocrystalline silicon chip as an example: 
1、Crystal orientation: <100> represents the crystallographic direction of the silicon wafer. This orientation has significant effects on the electronic properties of devices on the wafer and manufacturing processes.
2、Type: P (Boron) with one primary flat indicates that the wafer is P-type silicon, where boron is doped to create excess holes. "One primary flat" describes the shape of the wafer edge, aiding in identifying the crystal lattice orientation. Resistivity: 1-10 Ohm/cm is the resistivity of the wafer. Grade: Prime / CZ Virgin denotes the quality and purity of the silicon wafer. "Prime" is the highest grade, used for high-precision applications; "CZ" refers to the single-crystal silicon manufactured by the Czochralski process. Coating: None, native oxide only means that there are no additional film layers on the wafer surface, only a naturally formed silicon dioxide layer. Thickness: 525µm (+/- 20µm) is the thickness of the wafer, with an error controlled within plus or minus 20 micrometers. Thickness uniformity is crucial for subsequent processing steps. Diameter: 100mm specifies the diameter of the wafer. Warp: <=30µm, where lower warp indicates better wafer quality. Bowing: <=30µm, similar to warp, bowing is a measure of wafer flatness. The previous article introduced TTV, Bow, Warp of silicon wafers. Main orientation flat: 32.5 +/- 2.5mm indicates the length of the wafer's primary orientation flat, used for orienting the wafer. Some wafers may also have secondary orientation flats, as shown in the figure below.
Surface roughness: 0.2 - 0.3nm, polished one side indicates that the silicon wafer is single-side polished, and the surface roughness is measured in nanometers.
