Silicon rod cutting technology involves many aspects of technical difficulties, need to consider the mechanical, material, thermodynamics, fluid mechanics and other multidisciplinary knowledge, in order to achieve efficient, high-quality silicon cutting. Read More

After exposure, the exposed part will be removed by the developer, and the unexposed part will be retained. What is the mechanism Read More

Review the FEOL (pre-process), MOL (intermediate process) and BEOL (post-process) processes for planar transistor device structures. Note that the planar method works for 22nm and larger process nodes, while 14nm and smaller process nodes typically use a three-dimensional structure. Read More

Rate: HBM has a lower rate, but achieves high bandwidth through multi-layer stacking and wide bus. DDR5 has a higher rate and is suitable for scenarios that require fast data access.
Bandwidth: HBM achieves higher bandwidth through its architecture design, making it ideal for high-performance computing. DDR5 is relatively low in single memory bandwidth, but can achieve higher total bandwidth through multi-channel configurations.
Chip density: HBM achieves high density through 3D stacking, but a single stack has limited capacity. DDR5 achieves high capacity through a single-layer design and is suitable for big data storage needs.
HBM is suitable for high-performance computing applications that require extremely high bandwidth, while DDR5 is suitable for a wide range of consumer and enterprise application scenarios, providing high data rates and large capacity. Read More

In the process of soft baking, SOG solution flows into and fills the gaps and pits on the surface due to fluidity and capillary action, and can form a smooth and flat surface after full curing. Read More

resist is used as a mask to etch Si substrates. Places covered by photoresist will not be etched, and places not covered by photoresist will be etched. Read More