Since there is a traditional wire package, why use 2.5D,3D IC package, where are the advantages? Read More

Uptime is one of the core indicators to evaluate equipment performance and production efficiency. In the field of semiconductor manufacturing, the improvement of equipment Uptime can not only significantly improve production capacity and yield, but also reduce operating costs. Read More

The following questions are intended to comprehensively assess the technical depth, problem-solving skills, communication and collaboration skills of the engineers in the CMP field, as well as their thinking about future development. Read More

Why Develop Advanced Packaging?What is Moore's Law?In 1965, Intel co-founder Gordon Moore made a prediction that the number of transistors on an integrated circuit would roughly double every 18 months. This law has been the guiding principle of the semiconductor industry over the past few decades. Read More

A few years ago, there was a famous domestic master control factory, let's call it "big core company". The company has a young engineer named Tiger, he is smart, insight, always can find the company's hidden secrets.* 1The secret of screen printingOne day, Little Tiger was drinking coffee in his off Read More

I have observed that the lift off process and coating in the wafer fab are all by electron beam evaporation, and rarely by magnetron sputtering. Why? Read More