Silicon wafers are typically circular because they are cut from cylindrical monocrystalline silicon, a process that ensures the quality and manufacturing efficiency of silicon crystals. However, chips are square to maximize the utilization of space on these circular silicon wafers while also facilitating the design and manufacturing processes. The square shape of chips facilitates the organized arrangement of billions of transistors and makes cutting and packaging easier. Read More

In the field of power electronics, the traditional wire bonding technology's current-carrying capacity is gradually reaching its limit, hence tape bonding has emerged as an alternative solution. Compared to wire bonding, tape bonding offers better Rdson and thermal effects. Many traditional ultrasonic wedge wire bonding machines can easily adapt to handle tape bonding, making it attractive. Additionally, laser tape bonding is a burgeoning application in the electronics industry, particularly suitable for bonding wires to battery terminals and connecting to direct copper bonded (DCB) substrates and copper terminals in power electronic modules. Laser bonding enables tape bonding applications for larger currents. Read More

The summary of the passage is as follows: It mainly discusses the storage and transportation requirements of wafers after completion of production in the wafer fab. Wafers are typically stored in nitrogen cabinets with controlled humidity and temperature, and during transportation, they are placed in anti-static bags and cushioned packaging to prevent damage from impact. Key considerations include cleanliness, temperature and humidity control, physical protection, and addressing static electricity issues.
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The article outlines key terms in advanced packaging, including 2.5D and 3D packaging, Chiplet integration, Fan-Out Packaging, heterogeneous integration, HBM, interposer, redistribution layer, and TSV. 2.5D packaging stacks dies on an interposer with TSVs for connections, used in high-end devices. 3D packaging stacks dies vertically with TSVs, avoiding large SoCs. Chiplet allows modular chip integration for flexibility and cost-effectiveness. Fan-Out Packaging and FOWLP offer more I/Os and smaller sizes. HBM provides high-bandwidth channels. Interposer and redistribution layer facilitate tight connections. TSV enables vertical interconnections. Read More

Kajima Corp., amidst the semiconductor factory construction boom, faces challenges in Hokkaido's harsh conditions. Despite risks, they aim to complete tasks by December, employing up to 4,500 workers and implementing night shifts. Lessons from past projects inform strategies, including arranging buses for workers to avoid traffic jams. With four decades of experience, Takano, at 59, aims to mentor the next generation. The Rapidus project, though tough, is seen as an opportunity for growth. Read More

Japanese chip equipment company Towa has seen its stock price quadruple due to the demand for artificial intelligence chips. The company is highly regarded in the production of high-end memory chips, with its equipment being adopted by companies like SK Hynix and Samsung. Towa continues to develop new tools, promising to reduce chip molding costs. Its core business involves encasing chip metal molds and wires in resin to protect them from dust and moisture, thereby enhancing their performance. The surge in the company's stock price stems from the demand for high-performance chips and the increasing complexity of semiconductor design. Towa plans to achieve its goal of doubling its revenue over the next decade by expanding its capacity. The CEO of the company stated that they are committed to providing solutions where the technological value far exceeds the price. Read More