In the TSV process, the through-hole aspect ratio, and what problems will be caused by the aspect ratio. Read More

This article compares five mobile processor chips: Samsung's Tensor G3, Qualcomm's Snapdragon 8 Gen 3, MediaTek's Dimensity 9300, Google's Tensor G3, and Apple's A17 Pro. These chips target the high-end market, all based on Arm CPU architecture and Arm GPUs, though AI engines vary. While AI performance and CPU core counts differ, their internal arithmetic unit configurations remain similar. Chips made with TSMC's 4nm process show slightly higher frequencies, except for the A17 Pro, which, using TSMC's 3nm process, boasts the highest frequency. Die sizes are similar among the chips, with little distinction overall between Samsung and TSMC's chips. Qualcomm and MediaTek are expected to release 3nm products soon, subject to further comparison. Read More

"Recently, the joint laboratory at the Hangzhou International Science and Technology Innovation Center of Zhejiang University successfully grew silicon carbide single crystals with a thickness of up to 100 millimeters, marking a significant advancement in the field of silicon carbide single crystal growth. They utilized the Pulling Physical Vapor Transport (PPVT) method and proposed a multi-stage resistance heating strategy, combined with numerical simulation studies, to successfully design and optimize the growth thermal field and process means of 8-inch silicon carbide single crystals. Additionally, they successfully processed 8-inch silicon carbide substrates, thus joining the 8-inch silicon carbide club. This work provides an important foundation for further research and applications in the field of silicon carbide materials."






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The passage highlights the need for robust processors to handle the continuously growing data streams from sensors in automobiles. It emphasizes the persistence of sensor diversity due to varying environmental conditions. The computational requirements of processors depend on factors such as task quantity, sensor quantity, resolution, complexity of situations, and redundancy levels. It foresees the demand for memory and computational power increasing due to ADAS of level 3 and above in the future. Furthermore, it predicts a rise in global shipment volumes of silicon wafers for automotive semiconductors, with memory and logic chips being the primary contributors, and most wafers adopting process nodes of 350nm and above. Read More

Abstract: Semiconductor electronic heating equipment utilizes semiconductor heating technology to achieve efficient and energy-saving heating. Its operating principle relies on the high resistance characteristics of semiconductor materials, heating below three hundred and eighty degrees Celsius without generating light and sound losses, thus achieving one hundred percent energy conversion efficiency. This technology boasts advantages such as low energy consumption, fast heating speed, low operating costs, compact size, noise-free operation, unmanned supervision, long service life, and easy installation. Semiconductor electronic heating equipment finds wide applications in aerospace, transportation, industrial, agricultural, public utilities, and residential sectors, featuring functions like temperature control, energy utilization, and remote control. Read More

This section describes the surface roughness and polishing of the silicon wafer. The surface roughness is 0.2-0.3 nm, indicating the smoothness of the surface of the silicon wafer. At the same time, it is pointed out that the silicon wafer is a single cast silicon wafer, that is, only one side is polished. Read More